Forming a fin using double trench epitaxy

ABSTRACT

The present invention relates generally to semiconductor devices and more particularly, to a structure and method of forming a fin using double trench epitaxy. The fin may be composed of a III-V semiconductor material and may be grown on a silicon, silicon germanium, or germanium substrate. A double trench aspect ratio trapping (ART) epitaxy method may trap crystalline defects within a first trench (i.e. a defective region) and may permit formation of a fin free of patterning defects in an upper trench (i.e. a fin mold). Crystalline defects within the defective region may be trapped via conventional aspect ratio trapping or three-sided aspect ratio trapping. Fin patterning defects may be avoided by utilizing a fin mold to grow an epitaxial fin and selectively removing dielectric material adjacent to a fin region.

BACKGROUND

The present invention relates generally to semiconductor devices andmore particularly, to a structure and method of forming a semiconductorfin using double trench epitaxy.

In each new generation of semiconductor technology, transistor currenttends to decrease due to gate width reduction, mobility degradation ofminority carriers, and reduction of supply voltage. Reduced transistorcurrent may result in deterioration of circuit stability and may reducethe speed of circuit operation, both of which may cause degradation inperformance.

In some field effect transistor (FET) devices, one layer may be formedon another layer having a substantially different crystal latticeconstant, which may result in significant strain on the subsequentlyformed layer. For instance, conventional methods of herterointegrationof III-V compounds on materials such as silicon may result in strainwithin a III-V compound layer. Significant strain on a layer may resultin crystal lattice defects that may spread throughout a volume of thelayer during formation. The performance of devices fabricated usingdissimilar semiconductor materials can be materially affected by defectsthat cause abrupt changes in electrical and/or optical properties.Adverse effects due to misfit defects and threading dislocations shouldbe minimized or avoided in the fabrication of electronic devicesincorporating such semiconductor materials.

In addition, conventional methods for forming a fin in a fin fieldeffect transistor (FinFET) device may result in fin patterningdeformations, such as tapering and roughness. Patterning deformationsmay reduce performance in a FinFET device. Thus, patterning deformationsin a fin should be minimized or avoided in the fabrication of FinFETdevices.

SUMMARY

According to an embodiment, a method is disclosed. The method mayinclude: forming a first dielectric layer on a substrate; removing aportion of the first dielectric layer exposing a first upper surface ofthe substrate, wherein removing the portion of the first dielectriclayer forms a sidewall on one or more remaining portions of the firstdielectric layer and a lower trench extending across a length of thesubstrate; forming a second dielectric layer on the first upper surfaceof the substrate, in the lower trench, and on an upper surface of theone or more remaining portions of the first dielectric layer; forming athird dielectric layer on an upper surface of the second dielectriclayer; removing one or more portions of the third dielectric layer downto an upper surface of the second dielectric layer to form one or moreupper trenches, wherein a remaining portion of the third dielectriclayer above the lower trench has a width greater than a width of thelower trench; removing the second dielectric layer exposing an uppersurface of the one or more remaining portions of the first dielectriclayer and exposing the first upper surface of the substrate; forming anepitaxial layer on the first upper surface of the substrate and on theupper surface of the one or more remaining portions of the firstdielectric layer, the epitaxial layer filling the lower trench and theone or more upper trenches up to a height above an upper surface of thethird dielectric layer; and removing a portion of the epitaxial layerabove the upper surface of the third dielectric layer so that the uppersurface of the epitaxial layer is substantially flush with the uppersurface of the third dielectric layer.

According to an embodiment, another method is disclosed. The method mayinclude: forming a first dielectric layer on a substrate; removing aportion of the first dielectric layer exposing a first upper surface ofthe substrate, wherein removing the portion of the first dielectriclayer forms a sidewall on one or more remaining portions of the firstdielectric layer and a lower trench extending across a length of thesubstrate; forming a second dielectric layer on the first upper surfaceof the substrate, in the lower trench, and on an upper surface of theone or more remaining portions of the first dielectric layer; forming athird dielectric layer on an upper surface of the second dielectriclayer; forming a hardmask on a portion of the third dielectric layer sothat a exposed upper surface of the third dielectric layer runsperpendicular to the lower trench; removing an exposed portion of thethird dielectric layer, an exposed portion of the second dielectriclayer, and an exposed portion of the first dielectric layer down to asecond upper surface of the substrate; forming a support layer on thesecond upper surface of the substrate, the support layer having a heightextending at least to an upper surface of the third dielectric layer;removing the hardmask; removing one or more portions of the thirddielectric layer down to an upper surface of the second dielectric layerto form one or more upper trenches, wherein a remaining portion of thethird dielectric layer above the lower trench has a width greater than awidth of the lower trench; removing the second dielectric layer exposingan upper surface of the one or more remaining portions of the firstdielectric layer and exposing the first upper surface of the substrate;forming an epitaxial layer on the first upper surface of the substrateand on the upper surface of the one or more remaining portions of thefirst dielectric layer, the epitaxial layer filling the lower trench andthe one or more upper trenches up to a height above the upper surface ofthe third dielectric layer; and removing a portion of the epitaxiallayer above an upper surface of the third dielectric layer so that theupper surface of the epitaxial layer is substantially flush with theupper surface of the third dielectric layer.

According to an embodiment, a structure is disclosed. The structure mayinclude: a first dielectric layer on an upper surface of a substrate,wherein a lower trench extends a length of the substrate exposing afirst upper surface of the substrate and a sidewall on one or moreportions of the first dielectric layer, wherein the lower trench issurrounded by the first upper surface of the substrate at a bottom, asidewall of a first dielectric layer at two sides, an opening betweenthe first dielectric layer and a third dielectric layer at two sidesabove the sidewall, and a defect trapping surface of the thirddielectric layer at a top; a support layer on a second upper surface ofthe substrate, wherein a length of the support layer is perpendicular tothe length of the lower trench; and a third dielectric layer contacting,and anchored to, a sidewall of the support layer, the third dielectriclayer above, but not contacting, the first dielectric layer leaving theopening between the first dielectric layer and the third dielectriclayer, wherein one or more upper trenches extend through the thirddielectric layer down to the opening between the first dielectric layerand the third dielectric layer, wherein the one or more upper trenchesare above the first dielectric layer but not above the lower trench.

BRIEF DESCRIPTION OF THE DRAWINGS

The following detailed description, given by way of example and notintended to limit the invention solely thereto, will best be appreciatedin conjunction with the accompanying drawings, in which not allstructures may be shown.

FIG. 1 is a cross section view of a structure, which may include asubstrate, according to an embodiment of the present invention.

FIG. 2 is a cross section view of forming a first dielectric layer,according to an embodiment of the present invention.

FIG. 3 is a cross section view of removing a portion of the firstdielectric layer, according to an embodiment of the present invention.

FIG. 4 is a cross section view of forming a second dielectric layer,according to an embodiment of the present invention.

FIG. 5A is an isometric view of forming a third dielectric layer,according to an embodiment of the present invention.

FIG. 5B is a cross section view of forming the third dielectric layer,according to an embodiment of the present invention.

FIG. 6A is an isometric view of forming a hardmask, according to anembodiment of the present invention.

FIG. 6B is a cross section view of forming the hardmask, according to anembodiment of the present invention.

FIG. 7A is an isometric view of removing a portion of the firstdielectric layer, a portion of the second dielectric layer, and aportion of the third dielectric layer, according to an embodiment of thepresent invention.

FIG. 7B is a cross section view of removing the portion of the firstdielectric layer, the portion of the second dielectric layer, and theportion of the third dielectric layer, according to an embodiment of thepresent invention.

FIG. 8A is an isometric view of forming a support layer, according to anembodiment of the present invention.

FIG. 8B is a cross section view of forming the support layer, accordingto an embodiment of the present invention.

FIG. 9A is an isometric view of removing the hardmask, according to anembodiment of the present invention.

FIG. 9B is a cross section view of removing the hardmask, according toan embodiment of the present invention.

FIG. 10A is an isometric view of removing a portion of the thirddielectric layer, according to an embodiment of the present invention.

FIG. 10B is a cross section view of removing the portion of the thirddielectric layer, according to an embodiment of the present invention.

FIG. 11A is an isometric view of removing the second dielectric layer,according to an embodiment of the present invention.

FIG. 11B is a cross section view of removing the second dielectriclayer, according to an embodiment of the present invention.

FIG. 12 is a cross section view of forming an epitaxial layer, accordingto an embodiment of the present invention.

FIG. 13 is a cross section view of removing an upper portion of theepitaxial layer, according to an embodiment of the present invention.

FIG. 14 is a cross section view of removing an upper portion of thethird dielectric layer, according to an embodiment of the presentinvention.

FIG. 15 is a cross section view of removing a portion of the thirddielectric layer, according to an embodiment of the present invention.

FIG. 16 is a cross section view of removing a portion of the thirddielectric layer and a portion of the epitaxial layer, according to anembodiment of the present invention.

FIG. 17 is a cross section view of removing a fin portion of theepitaxial layer, according to an embodiment of the present invention.

FIG. 18 is a cross section view of forming a second epitaxial layer,according to an embodiment of the present invention.

FIG. 19 is a cross section view of removing an upper portion of thethird dielectric layer, according to an embodiment of the presentinvention.

FIG. 20 is a cross section view of removing a fin portion of theepitaxial layer, according to an embodiment of the present invention.

FIG. 21 is a cross section view of forming an isolation layer, accordingto an embodiment of the present invention.

FIG. 22 is a cross section view of forming a second epitaxial layer,according to an embodiment of the present invention.

FIG. 23 is a cross section view of removing an upper portion of thethird dielectric layer, according to an embodiment of the presentinvention.

The drawings are not necessarily to scale. The drawings are merelyschematic representations, not intended to portray specific parametersof the invention. The drawings are intended to depict only typicalembodiments of the invention. In the drawings, like numbering representslike elements.

DETAILED DESCRIPTION

Detailed embodiments of the claimed structures and methods are disclosedherein; however, it can be understood that the disclosed embodiments aremerely illustrative of the claimed structures and methods that may beembodied in various forms. This invention may, however, be embodied inmany different forms and should not be construed as limited to theexemplary embodiments set forth herein. Rather, these exemplaryembodiments are provided so that this disclosure will be thorough andcomplete and will fully convey the scope of this invention to thoseskilled in the art.

For purposes of the description hereinafter, the terms “upper”, “lower”,“right”, “left”, “vertical”, “horizontal”, “top”, “bottom”, andderivatives thereof shall relate to the disclosed structures andmethods, as oriented in the drawing figures. It will be understood thatwhen an element such as a layer, region, or substrate is referred to asbeing “on”, “over”, “beneath”, “below”, or “under” another element, itmay be present on or below the other element or intervening elements mayalso be present. In contrast, when an element is referred to as being“directly on”, “directly over”, “directly beneath”, “directly below”, or“directly contacting” another element, there may be no interveningelements present. Furthermore, the terminology used herein is for thepurpose of describing particular embodiments only and is not intended tobe limiting of the invention. As used herein, the singular forms “a,”“an,” and “the” are intended to include the plural forms as well, unlessthe context clearly indicates otherwise.

The terms “epitaxial growth and/or deposition” and “epitaxially formedand/or grown” mean the growth of a semiconductor material on adeposition surface of a semiconductor material, in which thesemiconductor material being grown has the same crystallinecharacteristics as the semiconductor material of the deposition surface.In an epitaxial deposition process, the chemical reactants provided bythe source gases are controlled and the system parameters are set sothat the depositing atoms arrive at the deposition surface of thesemiconductor substrate with sufficient energy to move around on thesurface and orient themselves to the crystal arrangement of the atoms ofthe deposition surface. Therefore, an epitaxial semiconductor materialhas the same crystalline characteristics as the deposition surface onwhich it is formed. For example, an epitaxial semiconductor materialdeposited on a {100} crystal surface will take on a <100> orientation.In some embodiments, epitaxial growth and/or deposition processes areselective to forming on semiconductor surface, and do not depositmaterial on dielectric surfaces, such as silicon dioxide or siliconnitride surfaces.

In the interest of not obscuring the presentation of embodiments of thepresent invention, in the following detailed description, someprocessing steps or operations that are known in the art may have beencombined together for presentation and for illustration purposes and insome instances may have not been described in detail. In otherinstances, some processing steps or operations that are known in the artmay not be described at all. It should be understood that the followingdescription is rather focused on the distinctive features or elements ofvarious embodiments of the present invention.

The present invention relates generally to semiconductor devices andmore particularly, to a structure and method of forming a semiconductorfin using double trench epitaxy. The semiconductor fin may be composedof a III-V semiconductor material and may be grown on a silicon, silicongermanium, or germanium substrate. III-V compounds offer a number ofadvantages over silicon with respect to the operation of semiconductordevices, such as a wider range of energy bandgaps. The heterointegrationof III-V compounds on materials such as silicon allows theco-integration of III-V n-channel FETs (nFETs) with silicon germaniump-channel FETs (pFETs).

Integrating III-V compounds on silicon is challenging because the III-Vcompounds may have a larger lattice constant. Conventional methods forforming III-V semiconductors on silicon may include blanket III-V growthand aspect ratio trapping (ART). Blanket growth may use thick III-Vlayers to trap much of the misfit dislocations near the latticemismatched interface of the two materials, but threading dislocationsmay still reach the upper portion of the semiconductor material. Defectdensities may range from approximately 10⁷ defects/cm² to approximately10⁹ defects/cm². ART may be performed using thinner III-V layers. DuringART deposition, a III-V material may be grown in narrow trenches thattrap misfit threading dislocations by stopping their propagation. Thedislocations may end at trench walls, but fairly high defect densities(i.e., up to 10⁸ dislocations/cm²) may still be observed.

Embodiments of the present invention may reduce crystalline latticedefects in a semiconductor fin and reduce sidewall roughness byexploiting the geometric configuration of the lattice structure. Morespecifically, two separate ART deposition processes may be used, once ina lower trench and again in an upper trench. The lower trench and uppertrench may be stacked on top of one another but be laterally offset toensure that crystal defects cannot propagate through both trenches. Theupper trench may have fin dimensions and serve as a fin mold. Anepitaxial layer may be grown in the upper trench. Embodiments of thepresent invention may involve epitaxially growing material within theupper trench between dielectric layers and then removing the dielectriclayers adjacent to the epitaxial layer. The exposed portion of theepitaxial layer may be used as a fin in a FinFET. Conventionaltechniques for removing dielectric material adjacent to an epitaxiallayer may be exceptionally precise, thus reducing tapering and sidewallroughness on the fin walls. Methods of forming a fin using a doubletrench aspect ratio trapping structure filled with an epitaxial layerare described below with reference to FIGS. 1-13.

Referring now to FIG. 1, a cross section view illustrating a structure100, which may be a starting point for the following fabrication steps,is shown. The structure 100 may include a substrate 110. The substrate110 may be composed of any semiconductor material known in the art,including, for example, silicon, germanium, silicon-germanium alloy,silicon carbide, silicon-germanium carbide alloy. In a preferredembodiment, the substrate 110 may be composed of silicon.

Referring now to FIG. 2, a cross section view illustrating forming afirst dielectric layer 220 on the substrate 110 is shown. The firstdielectric layer 220 may be formed using any deposition method known inthe art, such as, for example, chemical vapor deposition (CVD), plasmaenhanced chemical vapor deposition (PECVD), or physical vapor deposition(PVD). In a preferred embodiment, the first dielectric layer 220 may beformed by first depositing a semiconductor material on the substrate 110and then performing a thermal oxidation process to form an oxide. Thefirst dielectric layer 220 may be composed of any dielectric materialknown in the art, such as, for example, silicon oxide, silicon nitride,or any combination thereof. In a preferred embodiment, the firstdielectric layer 220 may be composed of silicon dioxide.

Referring now to FIG. 3, a cross section view illustrating removing aportion of the first dielectric layer 220 to form an opening 330 isshown. The opening 330 may expose a first upper surface 320. The firstupper surface 320 may have a width ranging from approximately 20 nm toapproximately 250 nm, and ranges therebetween. The width of the opening300 may be the same as the width of the first upper surface 320. Thefirst upper surface 320 may have a length which may be the same as alength of the substrate 110. The opening 330 may be defined by asidewall 325 of the first dielectric layer 220. In an embodiment, thesidewall 325 may have a height ranging from approximately 50 nm toapproximately 1000 nm, and ranges therebetween. In an embodiment, theopening 330 may be formed using a conventional masking and etchingprocess, such as, for example, a reactive-ion etch (RIE), a hotphosphoric acid etch, a selective wet etch, or a combination thereof.

Referring now to FIG. 4, a cross section view illustrating forming asecond dielectric layer 430 on an upper surface of the first dielectriclayer 220 and on the first upper surface 320 is shown. In an embodiment,the first dielectric layer 220 may be formed using any deposition methodknown in the art, such as, for example, CVD, PECVD, and PVD. In anotherembodiment, the second dielectric layer 430 may be formed by firstdepositing a semiconductor material on the first dielectric layer 220and the substrate 110 and then performing a thermal oxidation process toform an oxide.

The second dielectric layer 430 may be composed of any dielectricmaterial known in the art, such as, for example, silicon oxide, siliconnitride, or any combination thereof. In a preferred embodiment, thesecond dielectric layer 430 may be composed of a different material thanthe first dielectric layer 220. For example, if the first dielectriclayer 220 is composed of silicon oxide, the second dielectric layer 430may be composed of silicon nitride. The second dielectric layer 430 andthe first dielectric layer 220 may be composed of different materials toenable selective removal of the second dielectric layer in subsequentfabrication steps discussed below.

Referring now to FIGS. 5A-5B, an isometric view and a cross sectionalview along a section line A-A′, respectively, of forming a thirddielectric layer 540 are shown. The third dielectric layer 540 may beformed on an upper surface of the second dielectric layer 430. In anembodiment, the third dielectric layer 540 may be formed using anydeposition method known in the art, such as, for example, CVD, PECVD,and PVD. In another embodiment, the third dielectric layer 540 may beformed by first depositing a semiconductor material on the seconddielectric layer 430 and then performing a thermal oxidation process toform an oxide. The third dielectric layer 540 may be composed of anydielectric material known in the art, such as, for example, siliconoxide, silicon nitride, or any combination thereof. In a preferredembodiment, the third dielectric layer 540 may be composed of adifferent material than the second dielectric layer 430.

Referring now to FIGS. 6A-6B, an isometric view and a cross section viewalong the section line A-A′, respectively, of forming a hardmask 650 onan upper surface of the third dielectric layer 540 are shown. Thehardmask 650 may be formed over only a portion of the third dielectriclayer 540 using a patterning process, leaving a portion of the uppersurface of the third dielectric layer 540 exposed. The exposed portionof the upper surface of the third dielectric layer 540 may runperpendicularly to the length of the first upper surface 320 (FIG. 3).The hardmask 650 may be formed using any suitable deposition techniqueknown the art, including, for example, CVD, PVD, atomic layer deposition(ALD), molecular beam deposition (MBD), pulsed laser deposition (PLD),liquid source misted chemical deposition (LSMCD), sputtering, orplatting. The hardmask 650 may be composed of a dielectric material,such as, for example, silicon nitride, silicon oxide, siliconoxynitride, SiBCN, SiOCN, or a combination thereof. In a preferredembodiment, the hardmask 650 may be composed of silicon nitride.

Referring now to FIGS. 7A-7B, an isometric view and a cross section viewalong the section line A-A′, respectively, of removing the exposedportion of the third dielectric layer 540 and underlying portions of thesecond dielectric layer 430 and the first dielectric layer 220 areshown. In an embodiment, an second upper surface 720 of the substrate110 may be exposed. A length of the second upper surface 720 may beperpendicular to the length of the first upper surface 320. The exposedportion of the third dielectric layer 540 and the underlying portions ofthe second dielectric layer 430 and the first dielectric layer 220 maybe removed using a conventional etching process, such as, for example,RIE.

Referring now to FIGS. 8A-8B, an isometric view and a cross section viewalong the section line A-A′, respectively, of forming a support layer820 on the second upper surface 720 (FIG. 7) of the substrate 110 areshown. In an embodiment, the support layer 820 may be formed using anydeposition method known in the art, such as, for example, CVD, PECVD,and PVD. In another embodiment, the support layer 820 may be formed byfirst depositing a semiconductor material on the exposed upper surfaceof the substrate 110 and then performing a thermal oxidation process toform an oxide. The support layer 820 may be formed such that it has anupper surface that is substantially planar with the upper surface of thethird dielectric layer 540. The support layer 820 may be composed of anydielectric material known in the art, such as, for example, siliconoxide, silicon nitride, or any combination thereof. In a preferredembodiment, the support layer 820 may be composed of a differentmaterial than the second dielectric layer 430. In an embodiment, thesupport layer 820 may be composed of a similar material as the firstdielectric layer 220 and the third dielectric layer 540.

Referring now to FIGS. 9A-9B, an isometric view and a cross section viewalong the section line A-A′, respectively, of removing the hardmask 650(FIG. 8A) is shown. The hardmask 650 may be removed such that the uppersurface of the third dielectric layer 540 is exposed. In an embodiment,the hardmask 650 may be removed using a conventional etching process,such as, for example, RIE, a hot phosphoric acid etch, a selective wetetch, or a combination thereof. In a preferred embodiment, the hardmask650 may be removed using a conventional planarization process, such as,for example, chemical mechanical planarization (CMP).

Referring now to FIGS. 10A-10B, an isometric view and a cross sectionview along the section line A-A′, respectively, of forming one or moreupper trenches 1040 (hereinafter “upper trenches”) is shown. The uppertrenches 1040 may be formed by removing one or more portions of thethird dielectric layer 540, thereby exposing the upper surface of thesecond dielectric layer 430. The one or more portions of the thirddielectric layer 540 may be removed by a conventional masking andetching process. A defect trapping portion 1045 of the third dielectriclayer 540 may be formed on the second dielectric layer 430 above thefirst upper surface 320. The defect trapping portion 1045 may have awidth that is greater than the width of the opening 330 (FIG. 3). Thedefect trapping portion 1045 may have a width ranging from approximately40 nm to approximately 500 nm, and ranges therebetween.

Referring now to FIG. 11A-11B, an isometric view and a cross sectionview along the section line A-A′, respectively, of removing the seconddielectric layer 430 are shown. In an embodiment, the second dielectriclayer 430 may be removed selective to the support layer 820, the thirddielectric layer 540, the second using a conventional etching process,such as, for example, a hot phosphoric acid etch, a selective wet etch,or a combination thereof. The third dielectric layer 540 may remain inplace after removing the second dielectric layer 430 because a side ofthe third dielectric layer may be in contact with, and anchored to, thesupport layer 820. Removing the second dielectric layer may create anopening 1142 between the first dielectric layer 220 and the thirddielectric layer 540 in a portion of the space formerly occupied by thesecond dielectric layer. Removing the second dielectric layer 430 maycreate a lower trench 1132, which may be used to trap crystallinedefects in subsequent fabrication steps. The lower trench 1132 mayextend vertically from the first upper surface 320 of the substrate 110to a defect trapping surface 1140 on a bottom surface of the thirddielectric layer 540. The lower trench 1132 may extend horizontally fromone sidewall 325 to the other sidewall 325 within the opening 330 (FIG.3) at a bottom portion and extend horizontally within the opening 1142across the width of the defect trapping surface 1140. Thus, the lowertrench 1132 may be surrounded by the first upper surface 320 at abottom, the sidewall 325 at two sides, the opening 1142 above thesidewall 325 at two sides, and the defect trapping surface 1140 at atop.

Referring now to FIG. 12, a cross section view illustrating forming anfirst epitaxial layer 1230 on the upper surface of the first dielectriclayer 220 and on the first upper surface 320 is shown. The firstepitaxial layer 1230 may be composed of a semiconductor material, suchas, for example, silicon, germanium, silicon-germanium alloy, andcompound (e.g. III-V and II-VI) semiconductor materials. Non-limitingexamples of compound semiconductor materials include gallium arsenide,indium arsenide, and indium phosphide. In an embodiment, the firstepitaxial layer 1230 may be formed using a conventional epitaxialdeposition process known in the art, such as, for example, rapid thermalchemical vapor deposition (RTCVD), low-energy plasma deposition (LEPD),ultra-high vacuum chemical vapor deposition (UHVCVD), atmosphericpressure chemical vapor deposition (APCVD), or molecular beam epitaxy(MBE).

The first epitaxial layer 1230 and the substrate 110 may form anepitaxial interface where they contact one another. The first epitaxiallayer 1230 and the substrate 110 may have a lattice mismatch rangingfrom approximately 0% to approximately 20%, and ranges therebetween. Thelattice mismatch between the first epitaxial layer 1230 and thesubstrate 110 may result in relaxation and crystalline defects within aportion of the first epitaxial layer 1230 within the lower trench 1132.

In an embodiment, crystalline defects in the first epitaxial layer 1230may begin at the interface between the first epitaxial layer 1230 andthe first upper surface 320 of the substrate 110. The crystallinedefects may have a planar geometry and extend out from the epitaxialinterface. The crystalline defects may end at the sidewall 325 of thefirst dielectric layer 220 or at the defect trapping surface 1140,thereby staying trapped within three sides of the lower trench 1132. Forthe purposes of description hereinafter, the terms “three-sided aspectratio trapping,” “three-sided ART,” “TART,” and derivatives thereofshall relate to a method of trapping crystalline defects within thelower trench 1132 by blocking the spread of the defects with thesidewall 325 on two sides of the lower trench 1132 and the defecttrapping surface 1140 on top of the lower trench 1132. TART may involvea shallow wide geometry, a deep narrow geometry, or an array ofgeometries therebetween to capture crystalline defects. A shallow widegeometry may involve the sidewalls 325 with a small height and thedefect trapping surface 1140 with a large width to capture crystaldefects within the lower trench 1132. A deep narrow geometry may involvethe sidewalls 325 with a large height and a defect trapping surface 1140with a small width to capture crystal defects within the lower trench1132.

Referring now to FIG. 13, a cross section view illustrating removing anupper portion of the first epitaxial layer 1230 above the thirddielectric layer 540 is shown. The upper portion of the first epitaxiallayer 1230 above the third dielectric layer 540 may be removed by anymaterial removing process known in the art, such as, for example, CMP,such that an upper surface of the first epitaxial layer 1230 issubstantially flush with the upper surface of the third dielectric layer540.

Once the first epitaxial layer 1230 is formed, one or more semiconductorfins (hereinafter “semiconductor fins”) may be formed in the uppertrenches 1040. In some embodiments, as described below with reference toFIGS. 14-16, the first epitaxial layer 1230 within the upper trenches1040 may be used to form the semiconductor fins.

Referring now to FIG. 14, and in an embodiment, a cross section viewillustrating removing an upper portion of the third dielectric layer 540subsequent to the processing steps described above with reference toFIG. 13 is shown. In an embodiment, the upper portion of the thirddielectric layer 540 may be removed selective to the first epitaxiallayer 1230, such that a fin portion 1402 of the first epitaxial layer1230 is formed. The fin portion 1402 may be used as one or more fins insubsequently formed devices. The upper portion of the third dielectriclayer 540 may be removed using a conventional masking and etchingprocess, such as, for example, a RIE, a hot phosphoric acid etch, aselective wet etch, or a combination thereof.

Unlike conventional fin formation methods, which may involve removingmaterial from a semiconductor layer to leave one or more fins and maycause damage to fin sidewalls, embodiments of the present inventionremove the dielectric layer 540 selective to the fin portion 1402.Conventional fin formation methods may result in fins having a gradualslope (i.e. tapering), and a non-uniform texture on fin sidewalls (i.e.roughness). The fin portion 1402, however, may have minimal sidewalltapering and roughness since it is formed within the upper trenches 1040(FIG. 10) and substantially unaffected during the removal of the upperportion of the third dielectric layer 540.

Referring now to FIG. 15, and an in another embodiment, a cross sectionview illustrating removing a portion of the third dielectric layer 540(FIG. 13) subsequent to the processing steps described above withreference to FIG. 13 to expose an upper portion of the first epitaxiallayer 1230 is shown. The portion of the third dielectric layer 540 maybe removed selective to the first epitaxial layer 1230, such that a finportion 1502 of the first epitaxial layer 1230 is formed. In anembodiment, a portion of the third dielectric layer 540 may remain onthe first epitaxial layer 1230 above the lower trench 1132 (FIG. 11).The fin portion 1502 of the first epitaxial layer 1230 may be used asone or more fins in subsequently formed devices. The portion of thethird dielectric layer 540 may be removed using a conventional maskingand etching process, such as, for example, a RIE, a hot phosphoric acidetch, a selective wet etch, or a combination thereof.

Unlike conventional fin formation methods, which may involve removingmaterial from a semiconductor layer to leave one or more fins and maycause damage to fin sidewalls, embodiments of the present inventionremove the dielectric layer 540 selective to the fin portion 1502.Conventional fin formation methods nay result in fins having a gradualslope (i.e. tapering), and a non-uniform texture on fin sidewalls (i.e.roughness). The fin portion 1502, however, may have minimal sidewalltapering and roughness since it is formed within the upper trenches 1040(FIG. 10) and substantially unaffected during the removal of the portionof the third dielectric layer 540.

Referring now to FIG. 16, and in another embodiment, a cross sectionview illustrating removing a portion of the third dielectric layer 540and a portion of the first epitaxial layer 1230 subsequent to theprocessing steps described above with reference to FIG. 13 is shown. Theportion third dielectric layer 540 may be removed selective to the firstepitaxial layer 1230 using a conventional masking and etching process,such as, for example, a RIE, a hot phosphoric acid etch, a selective wetetch, or a combination thereof. In an embodiment, a portion of the thirddielectric layer 540 may remain on the first epitaxial layer 1230 abovethe lower trench 1132 (FIG. 11). A remaining portion of the firstepitaxial layer 1230 in the lower trench 1132 may contain the trappeddislocations described above with reference to FIG. 12.

After the portion of the third dielectric layer 540 is removed, anunderlying portion of the first epitaxial layer 1230 may be removed toexpose the upper surface of the first dielectric layer 220 and form afin portion 1602. The underlying portion of the first epitaxial layer1230 may be removed using any suitable material removal method known theart, such as, for example, sidewall image transfer (SIT). In a preferredembodiment, the underlying portion of the first epitaxial layer 1230adjacent to the upper trenches 1040 may be removed using isotropic RIE.A bottom surface of the fin portion 1602 may be on the upper surface ofthe first dielectric layer 220. The fin portion may be composed ofportions of the first epitaxial layer 1230 separated by a portion of thefirst dielectric layer 220.

Unlike conventional fin formation methods, which may involve removingmaterial from a semiconductor layer to leave one or more fins and maycause damage to fin sidewalls, embodiments of the present inventionremove the dielectric layer 540 selective to the fin portion 1602.Conventional fin formation methods nay result in fins having a gradualslope (i.e. tapering), and a non-uniform texture on fin sidewalls (i.e.roughness). The fin portion 1602, however, may have minimal sidewalltapering and roughness since it is formed within the upper trenches 1040(FIG. 10) and substantially unaffected during the removal of the portionof the third dielectric layer 540.

In other embodiments, as described below with reference to FIGS. 17-23,semiconductor fins may be formed by removing the epitaxial layer fromthe upper trenches 1040 (FIG. 10) and forming one or more subsequentlayers. Embodiments in which a second epitaxial layer is formed in theupper trenches 1040 are described below with reference to FIGS. 17-19.It should be noted that the processes steps described in FIG. 17 mayoccur in the fabrication process directly after the processing stepsdescribed above with reference to FIG. 13.

Referring now to FIG. 17, a cross section view illustrating removing aportion of the first epitaxial layer 1230 within the upper trenches 1040(FIG. 10) is shown. In an embodiment, the portion of the first epitaxiallayer 1230 within the upper trenches 1040 may be removed down to thebottom surface of the third dielectric layer 540. In another embodiment,the portion of the first epitaxial layer 1230 within the upper trenches1040 may be removed leaving a small portion of the first epitaxial layer1230 slightly above the bottom surface of the third dielectric layer540. The portion of the first epitaxial layer 1230 within the uppertrenches 1040 may be removed, selective to the third dielectric layer540, using any conventional material removal process known in the art,including, for example, a wet etch or RIE.

Referring now to FIG. 18, a cross section view illustrating forming asecond epitaxial layer 1840 on an upper surface of the first epitaxiallayer 1230 within the upper trenches 1040 (FIG. 10) is shown. The secondepitaxial layer 1840 may have a crystalline lattice constant similar tothe first epitaxial layer 1230. By having a similar crystalline latticeconstant, a potential for crystalline lattice defects within the secondepitaxial layer 1840 may be reduced. The second epitaxial layer 1840 maybe composed of a semiconductor material, such as, for example, silicon,germanium, silicon-germanium alloy, and compound (e.g. III-V and II-VI)semiconductor materials. Non-limiting examples of compound semiconductormaterials include gallium arsenide, indium arsenide, and indiumphosphide. In an embodiment, the second epitaxial layer 1840 may beformed using a conventional epitaxial deposition process known in theart, such as, for example, RTCVD, LEPD, UHVCVD, APCVD, or MBE. In anembodiment, the second epitaxial layer 1840 may be planarized using aconventional planarization process, such as CMP, such that an uppersurface of the second epitaxial layer 1840 is substantially flush withthe upper surface of the third dielectric layer 540.

Referring now to FIG. 19, a cross section view illustrating removing anupper portion of the third dielectric layer 540 adjacent to the secondepitaxial layer 1840 to form a fin portion 1902 is shown. The upperportion of the third dielectric layer 540 may be removed selective tothe second epitaxial layer 1840, such that the fin portion 1902 of thesecond epitaxial layer 1840 is formed. In an embodiment, a portion ofthe third dielectric layer 540 may remain on the first epitaxial layer1230 above the lower trench 1132 (FIG. 11). The fin portion 1902 of thesecond epitaxial layer 1840 may be used as one or more fins insubsequently formed devices. The portion of the third dielectric layer540 may be removed using a conventional masking and etching process,such as, for example, a RIE, a hot phosphoric acid etch, a selective wetetch, or a combination thereof.

Unlike conventional fin formation methods, which may involve removingmaterial from a semiconductor layer to leave one or more fins and maycause damage to fin sidewalls, embodiments of the present inventionremove the dielectric layer 540 selective to the fin portion 1902.Conventional fin formation methods may result in fins having a gradualslope (i.e. tapering), and a non-uniform texture on fin sidewalls (i.e.roughness). The fin portion 1902, however, may have minimal sidewalltapering and roughness since it is formed within the upper trenches 1040(FIG. 10) and substantially unaffected during the removal of the portionof the third dielectric layer 540.

Embodiments in which a second epitaxial layer is formed in the uppertrenches 1040 are described below with reference to FIGS. 20-23. Itshould be noted that the process steps described in FIG. 20 may occur inthe fabrication process directly after the processing steps describedabove with reference to FIG. 13.

Referring now to FIG. 20, a cross section view illustrating removing aportion of the first epitaxial layer 1230 within the upper trenches 1040is shown. In an embodiment, the portion of the first epitaxial layer1230 within the upper trenches 1040 may be removed down to the bottomsurface of the third dielectric layer 540. In another embodiment, theportion of the first epitaxial layer 1230 within the upper trenches 1040may be removed leaving a small portion of the first epitaxial layer 1230slightly above the bottom surface of the third dielectric layer 540. Theportion of the first epitaxial layer 1230 within the upper trenches 1040may be removed, selective to the third dielectric layer 540, using anyconventional material removal process known in the art, including, forexample, a wet etch or RIE.

Referring now to FIG. 21, a cross section view illustrating forming anisolation layer 2140 on an upper surface of the first epitaxial layer1230 within the upper trenches 1040 is shown. The isolation layer 2140may be formed using any deposition method known in the art, such as, forexample, CVD, PECVD, or PVD. The first isolation layer 2140 may becomposed of any dielectric material known in the art, such as, forexample, silicon oxide, silicon nitride, or any combination thereof. Ina preferred embodiment, the isolation layer 2140 may be composed ofindium aluminum arsenide.

Referring now to FIG. 22, a cross section view illustrating forming asecond epitaxial layer 2260 on an upper surface of the isolation layer2140 within the upper trenches 1040 is shown. The second epitaxial layer2260 may be composed of a semiconductor material, such as, for example,silicon, germanium, silicon-germanium alloy, and compound (e.g. III-Vand II-VI) semiconductor materials. Non-limiting examples of compoundsemiconductor materials include gallium arsenide, indium arsenide, andindium phosphide. In an embodiment, the second epitaxial layer 2260 maybe formed using a conventional epitaxial deposition process known in theart, such as, for example, RTCVD, LEPD, UHVCVD, APCVD, or MBE. In apreferred embodiment, the second epitaxial layer 2260 may be composed ofindium gallium arsenide. Indium gallium arsenide with 53% Indium hasnearly the same crystalline lattice constant as indium aluminum arsenidewith 48% Indium, but indium aluminum arsenide has a larger bandgap thanindium gallium arsenide. Thus, indium aluminum arsenide may act as anelectrical isolator for the second epitaxial layer 2260 and may alsoserve as a crystalline surface for epitaxial growth. In an embodiment,the second epitaxial layer 2260 may be planarized using a conventionalplanarization process, such as CMP, such than an upper surface of thesecond epitaxial layer 2260 is substantially flush with the uppersurface of the third dielectric layer 540.

Referring now to FIG. 23, a cross section view illustrating removing anupper portion of the third dielectric layer 540 adjacent to the secondepitaxial layer 2260 to form a fin portion 2302 is shown. The upperportion of the third dielectric layer 540 may be removed selective tothe second epitaxial layer 2260, such that the fin portion 2302 of thesecond epitaxial layer 2260 is formed. In an embodiment, a portion ofthe third dielectric layer 540 may remain on the first epitaxial layer1230 above the lower trench 1132 (FIG. 11). The fin portion 2302 of thesecond epitaxial layer 2260 may be used as one or more fins insubsequently formed devices. The portion of the third dielectric layer540 may be removed using a conventional masking and etching process,such as, for example, a RIE, a hot phosphoric acid etch, a selective wetetch, or a combination thereof.

Unlike conventional fin formation methods, which may involve removingmaterial from a semiconductor layer to leave one or more fins and maycause damage to fin sidewalls, embodiments of the present inventionremove the dielectric layer 540 selective to the fin portion 2302.Conventional fin formation methods may result in fins having a gradualslope (i.e. tapering), and a non-uniform texture on fin sidewalls (i.e.roughness). The fin portion 2302, however, may have minimal sidewalltapering and roughness since it is formed within the upper trenches 1040(FIG. 10) and substantially unaffected during the removal of the portionof the third dielectric layer 540.

Embodiments of the present invention may allow for formation of a finfree of crystalline defects and free of fin patterning defects.Epitaxial deposition in a tiered double trench aspect ratio trappingstructure may trap crystalline defects within the lower trench 1132(i.e. a defective region) and may permit formation of a fin free ofpatterning defects in one or more upper trenches 1040 (i.e. one or morefin molds). Crystalline defects within the defective region may betrapped in the lower trench 1132 via conventional aspect ratio trappingor three-sided aspect ratio trapping. Fin patterning defects may beavoided by utilizing a fin mold to grow an epitaxial fin and selectivelyremoving dielectric material adjacent to a fin region.

The descriptions of the various embodiments of the present inventionhave been presented for purposes of illustration, but are not intendedto be exhaustive or limited to the embodiments disclosed. Manymodifications and variations will be apparent to those of ordinary skillin the art without departing from the scope and spirit of the describedembodiments. The terminology used herein was chosen to best explain theprinciples of the embodiment, the practical application or technicalimprovement over technologies found in the marketplace, or to enableothers of ordinary skill in the art to understand the embodimentsdisclosed herein.

What is claimed is:
 1. A method comprising: forming a first dielectriclayer on a substrate; removing a portion of the first dielectric layerto form a first trench and expose an upper surface of the substrate;forming a second dielectric layer on the first dielectric layer and inthe first trench; forming a third dielectric layer on the seconddielectric layer; removing one or more portions of the third dielectriclayer down to the second dielectric layer to form one or more secondtrenches, leaving a remaining portion of the third dielectric layerabove the first trench, and the remaining portion of the thirddielectric layer having a width greater than a width of the firsttrench; completely removing the second dielectric layer exposing thefirst dielectric layer and exposing the upper surface of the substrate;and forming an epitaxial layer on the upper surface of the substrate andon the first dielectric layer, the epitaxial layer filling the firsttrench and the one or more second trenches.
 2. The method of claim 1,further comprising: recessing the third dielectric layer exposing aplurality of fin portions of the epitaxial layer.
 3. The method of claim1, further comprising: removing the third dielectric layer, leaving thefirst trench covered, and exposing a plurality of fin portions of theepitaxial layer; and removing the epitaxial layer adjacent to theplurality of fin portions of the epitaxial layer down to the firstdielectric layer.
 4. The method of claim 1, further comprising: removingthe epitaxial layer from the one or more second trenches no further downthan a bottom surface of the third dielectric layer; forming a secondepitaxial layer within the one or more second trenches; and partiallyremoving the third dielectric layer adjacent to each of the secondepitaxial layer in each of the one or more second trenches.
 5. Themethod of claim 1, further comprising: removing a portion of theepitaxial layer within the one or more second trenches no further downthan a bottom surface of the third dielectric layer; forming anisolation layer on the epitaxial layer within the one or more secondtrenches; forming a second epitaxial layer on an upper surface of theisolation layer within the one or more second trenches; and removing aportion of the third dielectric layer adjacent to the second epitaxiallayer to form a fin portion.
 6. The method of claim 1, wherein theepitaxial layer comprises a III-V compound semiconductor.
 7. The methodof claim 1, wherein the first dielectric layer comprises a similardielectric material as the third dielectric layer and a differentdielectric material than the second dielectric layer.
 8. A methodcomprising: forming a first dielectric layer on a substrate; removing aportion of the first dielectric layer to form a first trench and exposean upper surface of the substrate; forming a second dielectric layer onthe first dielectric layer and in the first trench; forming a thirddielectric layer on the second dielectric layer; forming a hardmaskabove first portions of the third dielectric layer, the seconddielectric layer, and the first dielectric layer; removing secondportions of the third dielectric layer, the second dielectric layer, andthe first dielectric layer selective to the hardmask down to the uppersurface of the substrate; forming a support layer on the upper surfaceof the substrate, the support layer having a height extending at leastto an upper surface of the third dielectric layer; removing one or moreportions of the third dielectric layer down to the second dielectriclayer to form one or more second trenches, leaving a remaining portionof the third dielectric layer above the first trench, and the remainingportion of the third dielectric layer having a width greater than awidth of the first trench; removing the second dielectric layer exposingthe first dielectric layer and exposing the upper surface of thesubstrate; and forming an epitaxial layer on the upper surface of thesubstrate and on the first dielectric layer, the epitaxial layer fillingthe first trench and the one or more second trenches.
 9. The method ofclaim 8, further comprising: recessing the third dielectric layerexposing a plurality of fin portions of the epitaxial layer.
 10. Themethod of claim 8, further comprising: removing the third dielectriclayer, leaving the first trench covered, and exposing a plurality of finportions of the epitaxial layer; and removing the epitaxial layeradjacent to the plurality of fin portions of the epitaxial layer down tothe first dielectric layer.
 11. The method of claim 8, furthercomprising: removing the epitaxial layer from the one or more secondtrenches no further down than a bottom surface of the third dielectriclayer; forming a second epitaxial layer within the one or more secondtrenches; and partially removing the third dielectric layer adjacent toeach of the second epitaxial layer in each of the one or more secondtrenches.
 12. The method of claim 8, further comprising: removing aportion of the epitaxial layer within the one or more second trenches nofurther down than a bottom surface of the third dielectric layer;forming an isolation layer on the epitaxial layer within the one or moresecond trenches; forming a second epitaxial layer on an upper surface ofthe isolation layer within the one or more second trenches; and removinga portion of the third dielectric layer adjacent to the second epitaxiallayer to form a fin portion.
 13. The method of claim 8, wherein theepitaxial layer comprises a III-V compound semiconductor.
 14. The methodof claim 8, wherein the first dielectric layer comprises a similardielectric material as the third dielectric layer and a differentdielectric material than the second dielectric layer.